By Caroline Osterman
The College of Engineering and the Fung Institute for Engineering Leadership are pleased to announce the recipients of the 2017–18 Eaton-Hachigian Fellowships, awarded this year to two students pursuing Master of Engineering degrees at UC Berkeley. Selected by the Dean of the
College of Engineering, the Eaton-Hachigian Fellows are engineering graduate students, pursuing studies in energy-efficient electrical and power hardware or software solutions, wireless communications and sensing devices, or specialty materials.
The Eaton-Hachigian Fellowship was established in 2008 by gifts from the Cooper Industries Foundation and from Berkeley alumnus and the former Chairman, President, and CEO of Cooper Industries, Kirk Hachigian, ‘82. Cooper Industries became part of Eaton Corporation in 2012, and
the name of the fellowship was changed in 2017 from the Cooper Fellowship to the Eaton-Hachigian Fellowship.
This year’s fellows are Nagapratik Mundla and Jonathan Wang:
Nagapratik Mundla
Candidate for MEng in Materials Science & Engineering
Fellowship category: Specialty Materials
Undergraduate degree: Chemical Engineering, Indian Institute of Technology
Capstone project: Designing Next Generation 3D Printer Materials
Capstone adviser: Tarek Zohdi, Professor, Mechanical Engineering
Jonathan Wang
Candidate for MEng in Electrical Engineering & Computer Sciences
Fellowship category: Wireless Communications & Sensing Devices
Undergraduate degree: Electrical Engineering, University of Illinois
at Urbana-Champaign
Capstone project: Capstone Design Experience: IoT System-on- Chip
Capstone adviser: Kristofer Pister, Professor, EECS
Congratulations to this year’s fellowship awardees!
2018 Eaton-Hachigian Fellowship Recipients was originally published in Berkeley Master of Engineering on Medium, where people are continuing the conversation by highlighting and responding to this story.