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Nanoscale Manufacturing Capstone team

Nanoscale Manufacturing

December 28, 2018 by

The team evaluated opportunities for fabricating electronic devices using a new exfoliation process, called “Covalent Bond Exfoliation.” They sought to apply this method to transfer 2D materials reliably and manufacture heterostructure devices massively to make impacts to the society.

Team: Shu-Ting Ko, Nai-Wen Hu, Jing Chao Yang
Advisors: Daryl Chrzan, Joel Ager, Ali Javey, Hayden Taylor

The Problem: The bottleneck of Moore’s law poses a challenge to shrinking chip sizes, which cannot satisfy increasing demands for higher chip speed and density.

The Goal: Evaluate opportunities for fabricating devices using a new exfoliation process — Covalent Bond Exfoliation (CoBEx). Apply CoBEx to transfer 2D materials reliably and fabricate heterostructure devices to make impacts to the society.

IC Chip+ 2D Materials: 2D materials overcome the limitation, which motivates us to develop a simpler, faster, and reliable 2D manufacturing process for realizing mass production.

Application:

  • OLED
  • Transistor
  • Photodetector
  • Memristor
Nanoscale Manufacturing Project Brief 2017-18

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