[vc_row][vc_column][vc_column_text]
The team evaluated opportunities for fabricating electronic devices using a new exfoliation process, called “Covalent Bond Exfoliation.” They sought to apply this method to transfer 2D materials reliably and manufacture heterostructure devices massively to make impacts to the society.
[/vc_column_text][vc_column_text]Team: Shu-Ting Ko, Nai-Wen Hu, Jing Chao Yang
Advisors: Daryl Chrzan, Joel Ager, Ali Javey, Hayden Taylor[/vc_column_text][vc_row_inner][vc_column_inner width=”2/3″][vc_column_text]The Problem: The bottleneck of Moore’s law poses a challenge to shrinking chip sizes, which cannot satisfy increasing demands for higher chip speed and density.
The Goal: Evaluate opportunities for fabricating devices using a new exfoliation process — Covalent Bond Exfoliation (CoBEx). Apply CoBEx to transfer 2D materials reliably and fabricate heterostructure devices to make impacts to the society.
IC Chip+ 2D Materials: 2D materials overcome the limitation, which motivates us to develop a simpler, faster, and reliable 2D manufacturing process for realizing mass production.
Application:
- OLED
- Transistor
- Photodetector
- Memristor
[/vc_column_text][/vc_column_inner][vc_column_inner width=”1/3″][vc_video link=”https://www.youtube.com/watch?v=fqp-Dzc6tw4″][/vc_column_inner][/vc_row_inner][vc_separator][vc_single_image image=”41146″ img_size=”full”][/vc_column][/vc_row]